January 29, 2007 – AMI Semiconductor is in full production mode with Advanced Interconnect Technologies’ (AIT) stacked-die quad flat package no leads (QFN) modules, which AMI will incorporate into several consumer electronics applications, the companies said today.

The QFN-MCM product uses a pyramid formation of stacked, wire-bonded die in a system-in-package (SiP), explained company spokesperson Chris Stai to SST sister publication Advanced Packaging, and exhibits a smaller footprint (3 x 3mm) than ICs with side-by-side die, and better thermal management due to a shortened interconnect from the 7-mil-thick die to leadframe. He added that the pyramid structure makes assembly “straightforward,” and that die are tested with wafer probes prior to stacking to ensure known good die (KGD) are used. AMI did not release information on specific applications using the QFNs.

AIT plans to focus a large percentage of its 2007 R&D efforts on various stacked die and how to incorporate 3-D packaging with familiar infrastructures and materials, noted Stai. He said that a “deep relationship” with AMI and several parameters influenced development of the QFN with stacked die, and referenced analyst predictions of a BGA-substrate shortage as an indicator that influenced AIT to use more conventional leadframe substrates.

To learn more about current supply for advanced substrates, read AP‘s Substrate possibilities and limitations.