DuPont intros new Fodel photoimageable thick-film pastes

Jan. 16, 2007 — DuPont Microcircuit Materials, part of DuPont Electronic Technologies, announced the introduction of its 7th Generation DuPont Fodel photoimageable thick-film pastes for the metallization of the front bus electrode used in plasma display panels (PDPs).

The 7G Fodel pastes provide improved image quality and enable substantial cost reductions through lower paste consumption and reduced precious metal content, according to the company. The 7G DuPont Fodel photoimageable thick-film paste is fully lead free and is intended to provide the same cost-effective, high-performance metallization for PDPs expected from the industry-standard DuPont Fodel system.

“The rapid growth in the PDP market has put pressure on suppliers to develop lower cost and higher performance materials solutions, including improved image quality through better bright and dark contrast and finer resolution for full high definition (Full HD) television,” said Walt Cheng, global business director, DuPont Microcircuit Materials, in a prepared statement.

“Customers using the 7G system have targeted reduced ruthenium (Ru) and other precious metal content, and lower paste usage as key strategies for cost reduction. Our 7G products allow PDP manufacturers to substantially reduce paste usage, to deliver world class image quality and finer line resolution for Full HD designs. We expect this to support the continued growth of the PDP industry and allow more consumers to enjoy the visual experience offered by high definition, flat panel plasma televisions.”


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