Fraunhofer to Use STS’s DRIE in Packaging Research

(January 24, 2007) NEWPORT, Wales, U.K. &#151 Surface Technology Systems plc (STS) won a European Union (EU) tender from the Fraunhofer-Institut f&#252r Zuverl&#228ssigkeit und Mikrointegration IZM (Munich, Germany) for an MPX Pegasus system. The advanced silicon etch (ASE) system has a single process chamber with manually loaded vacuum loadlock and a carousel wafer handler for 2-4 wafers. Fraunhofer IZM will use the system in industrial R&D for packaging applications.


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