Tool helps increase manufacturing yield of micro-electro-mechanical systems (MEMS) by as much as 50 percent
January 8, 2007 — /BUSINESS WIRE/ — PASADENA, CA — Tanner Labs, a division of Tanner Research, today said it will begin offering scanning electron micrograph (SEM) services in its MEMS R&D and Fabrication Facility in Pasadena. Tanner has used the SEM system internally but is now offering it externally.
MEMS, or micro-electro-mechanical devices, integrate traditional microelectronics, or silicon-based devices, with mechanical elements, sensors and actuators to create chips that have not just computational capabilities but can sense and control. MEMS devices are used in a variety of applications including biotechnology, communications, accelerometers for crash testing and many others that require analysis and control.
The SEM services from Tanner Labs rapidly image and critical process steps on wafer lots, which helps improve the numbers of usable devices made by as much as 50 percent. Imaging of thin films and structures during processing enables subsequent process steps to be optimized for maximizing device yield.
The SEM device, a Cambridge Stereoscan 240, can load sample sizes as large as four inches with resolution of 10 nanometers. This resolution limit is useful for examining nano-structures with sub-micron features.
Other key features of the SEM system include:
* Acceleration voltage of 0.3kV to 30kV enabling examination of uncoated or delicate specimens, which are sensitive to electron bombardment
* Magnification between 5 and 300,000 times of actual features
* Chamber capacity of 200 mm diameter devices, enabling monitoring large device arrays without destructive dicing or cleaving
Tanner Research, Inc.
Founded in 1988, Tanner Research, Inc. is a privately held company headquartered in Monrovia, CA. Tanner Research, through its MEMS R&D and Fabrication Facility supports advanced research and development. The facility provides more than 1,000 square feet of dedicated Class 1000 and Class 100 cleanroom space and enables the development and low-volume manufacturing of MEMS using traditional silicon-based processes, as well as innovative and non-traditional, low-temperature (<250