Advanced Packaging Software

The Turbo Package Analyzer v5. introduces automation, design flow, and simulation capabilities to the software program, enabling extraction of electrical characteristics for complex BGA packages &#151 wire-bond BGAs, flip chip BGAs, chip-scale packages (CSPs), and system-in-package (SiP). SiP design tools include wirebond layouts for trace-to-trace, cascaded, and die-to-die configurations.


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