BPA Appraises Coreless and Thin-core Substrates

(February 9, 2007) DORKING, Surrey, U.K. &#151 BPA Consulting Ltd. released its market predictions for coreless and thin-core substrates for IC packages. BPA defines coreless and thin-core as emerging technologies, which reached a $1 million market in 2005. BPA expects the market to burst open to $2B by 2011.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.