BPA Appraises Coreless and Thin-core Substrates

(February 9, 2007) DORKING, Surrey, U.K. &#151 BPA Consulting Ltd. released its market predictions for coreless and thin-core substrates for IC packages. BPA defines coreless and thin-core as emerging technologies, which reached a $1 million market in 2005. BPA expects the market to burst open to $2B by 2011.

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