Dynaloy, BASF Expand WLP Partnership

(February 22, 2007) INDIANAPOLIS and LUDWIGSHAFEN, Germany &#151 Dynaloy LLC and BASF AG entered into an expanded sales and distribution agreement for strippers and cleaners used in wafer-level packaging (WLP) and bumping processes. BASF, a chemical supplier, expects the partnership to broaden its back-end semiconductor market penetration, while Dynaloy is targeting market access in Asia and Europe.


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