February 23, 2007 – Japanese DRAM firm Elpida Memory Inc. said it has agreed to sell 200mm wafer processing equipment from its Hiroshima facility to Cension Semiconductor Manufacturing Corp. in order to narrow its focus to 300mm chipmaking operations.

The toolset will be transferred to Cension in Chengdu, where it will be operated by domestic chipmaker Semiconductor Manufacturing International Corp. (SMIC), according to Elpida. The companies say they will now further negotiate details of the transfer.

“Elpida expects that the Hiroshima Elpida’s 200mm equipment will be used more efficiently by SMIC, and we have intention to continue to provide support to customers who have placed orders for production of 200mm wafer line products,” the company said, in a statement.