Epson Selects SUSS for WLCSP

(February 5, 2007) MUNICH, Germany &#151 Seiko Epson Corp. purchased an MA200Compact mask aligner from SUSS MicroTec to support wafer-level chip-scale packaging (WLCSP). Epson evaluated several systems, selecting SUSS due to the machine’s throughput and submicron overlay and alignment accuracy. SUSS will deliver the system, ordered in Q’04 2006, to Epson’s Japan location.


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