FEI has introduced the Quanta 3D FEG, which it says is the first high-resolution, low-vacuum SEM/FIB (DualBeam) for 3D material characterization, failure analysis, and process control. This latest addition to FEI’s Quanta family follows the launch of the Helios NanoLab in August 2006.
According to FEI, the Quanta 3D FEG is also the first high-resolution DualDeam featuring three operating modes in a single, integrated system: high vacuum, low vacuum and ESEM. The ESEM mode makes it possible to collect data on any sample, regardless of heat, moisture or dirt levels, as well as to characterize in-situ dynamic experiments with live recording.
“With its unmatched 65nA high current ion beam capability, the Quanta 3D FEG allows very fast milling and precise cross-sectioning to reveal sub-surface structures and features,” the company says. And, with its 200nA electron beam current capability, the Quanta 3D FEG promises fast 3D analytical capabilities which to speed your understanding of the specimen.