Flip Chip Bonding and Underfill System

The FS2500N meets requirements for high-density interconnects (HDI) with reportedly increased speed and accuracy over previous generations. Its flip chip packing system performs alignment and bonding at 1.7 sec. per chip excluding process time, with accuracies of less than 2 &#181m, and the bonding system suits various materials with low voiding.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.