Honeywell to Expand Packaging Materials R&D

(February 15, 2007) TEMPE, AZ &#151 Honeywell Electronic Materials will expand its Spokane, WA, R&D center for advanced packaging materials, investing more than $1 million and adding about 85 pieces of equipment. The company plans to develop thermal management, electrical interconnect, and burn-in materials. The construction project is expected to finish by the end of 2007.


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