Nextreme Names Packaging-focused CTO

(February 9, 2007) RESEARCH TRIANGLE PARK, NC &#151 Nextreme Thermal Solutions appointed Seri Lee, Ph.D., as chief technology officer. Bringing Lee to Nextreme is part of a corporate plan to focus on electronic and optoelectronic packaging, and thermal management, said Jesko von Windheim, CEO, adding that Lee will also advance the company’s efforts in thermoelectric power generation.


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