Spansion upgrades to 300mm flash at US R&D site

February 1, 2007- Spansion Inc. says it has completed the transition of migrating from 200mm to 300mm wafer processing at its Submicron Development Center R&D facility in Sunnyvale, what the company claims is the state’s first 300mm R&D facility, and the only Silicon Valley company with 300mm flash memory in development.

The 300mm process will be transferred to Spansion’s new SP1 300mm manufacturing facility in Aizu-Wakamatsu, Japan, which is expected to begin production of 65nm MirrorBit flash memory devices by late 2007, followed by 45nm production by mid-2008, the company said.

Spansion says it has invested $2 billion in the Submicron Development Center since it was opened in 1990. The site employs 500 workers: engineers, technicians, and facilities personnel.


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