EI Receives DoD Contracts

(March 23, 2007) ENDICOTT, NY &#151 The U.S. Department of Defense (DoD) awarded $164 million in contracts for engineering, verification, and production to Endicott Interconnect Technologies, Inc. (EI). The project includes organic packaging; module assembly; PCB design and fabrication; board assembly; verification and test of these systems; and support for logistics, shipping, and storage. The end product is a high-reliability, high-performance computing application.


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