Fan-in PoP Allows Flexible Die Parameters

(March 26, 2007) SINGAPORE &#151 STATS ChipPAC Ltd. developed a fan-in package-on-package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages. The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space, without the footprint and ball-height constraints of prior designs.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.