IBM Prototypes Optical SiP

(March 26, 2007) ANAHEIM, CA and YORKTOWN HEIGHTS, NY &#151 Based on the concept of reducing costs through packaging integration, IBM researchers will introduce an optical chipset prototype for supercomputing applications that incorporates optical and CMOS components in one system-in-package (SiP), or optical module, at the 2007 Optical Fiber Conference, March 25–29 in Anaheim.


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