Infotonics Selects SUSS Bonders for MEMS

(March 28, 2007) MUNICH, Germany and CANANDAIGUA, NY &#151 Infotonics, a collaborative center of excellence for photonics and microsystems in Canandaigua, chose the SUSS ABC200 wafer-bonding cluster tool and FC150 device bonder as strategic investments for its MEMS packaging laboratory.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.