Infotonics Selects SUSS Bonders for MEMS

(March 28, 2007) MUNICH, Germany and CANANDAIGUA, NY &#151 Infotonics, a collaborative center of excellence for photonics and microsystems in Canandaigua, chose the SUSS ABC200 wafer-bonding cluster tool and FC150 device bonder as strategic investments for its MEMS packaging laboratory.


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