MicroChem’s new plating resists enable tall, dense microstructures

KMPR 1000 promises to enable microplated structures not previously achievable. (Photo: MicroChem)

Mar. 23, 2007 — MicroChem Corp. , manufacturer of lift-off, MEMS, e-beam and other specialty resists, introduces two new products that together promise high aspect ratio imaging with vertical sidewalls, enabling the design of tall and dense micro plated structures not previously achievable.

The products are KMPR 1000, a high performance liquid resist that MicroChem developed in cooperation with Nippon Kayaku Corporation of Japan, and Remover K, an aqueous stripper system for KMPR 1000 removal. KMPR 1000 is an epoxy-based, negative-acting, high contrast, i-line sensitive photoresist that, when used with Remover K, enables aspect ratios up to 10:1.

KMPR 1000 can be coated onto a substrate at thicknesses from 4 microns to 100 microns with a single spin coating. It promises compatibility with conventional aqueous developers (0.26N TMAH or KOH) and solvent-based developers, such as SU-8 Developer. High chemical resistance and excellent adhesion make it suitable for use with a wide variety of electrolytic plating chemistries.

Although KMPR 1000 can be stripped in typical solvents such as NMP, Remover K is recommended to completely remove the resist, especially for high aspect ratio plating applications. Plasma removal is also possible.

According to Luc Oullet, P. Eng., Director, Technology Development at DALSA Semiconductor, “KMPR meets all of the requirements for MEMS processing, with its high throughput, excellent aspect ratio control (exceeding 7:1), wet strip capability and adhesion.”

Peter ten Berge, ASML, Special Applications, states that “The photosensitivity and high aspect ratio of KMPR is a MEMS technology enabler that never existed before under i-line illumination.”

KMPR 1000 is available in four viscosities for spin coat application and various package sizes from 500 ml to 20 liters.

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