Quantum Leap’s “industry breakthrough” in hermetic packaging targets MEMS

March 26, 2007 — Quantum Leap Packaging, Inc. (QLP), provider of air cavity packages for semiconductor assembly, has announced the availability of HermeTech, which it says is the industry’s first hermetic plastic package to meet JEDEC standards. With this release, the company is targeting advanced packaging applications such as image sensors, HB-LEDs, MEMS, LDMOS, and RF microwave devices.

QLP is manufacturing HermeTech plastic air cavity QFNs (quad flat no-lead packages) that maintain hermetic leak rates of less than 5×10-8 atm cc/s He, and pass full Mil Spec reliability tests. By combining its Quantech material technology and UltraSeal ultrasonic lid process, QLP has developed HermeTech QFNs that feature customizable properties, low moisture permeability and high temperature stability and promise true hermetic performance.

QLP says HermeTech combines the hermetic performance and reliability of ceramic packages with design flexibility and tailored material properties to solve longstanding packaging problems. “I see QLP’s breakthrough technology leading the next generation of semiconductor packaging,” says David Grooms, CEO of Quantum Leap Packaging.

Hermetic levels have never been achieved with organic materials, according to QLP.


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