SEMATECH’s 3D push kicks off program-based membership plan

March 21, 2007 – Chipmaking consortium SEMATECH is kickstarting a planned revamp of its membership business model into program-level participation, by opening the doors to new members to join its 3D Interconnect program.

The move aims to provide more flexibility for members, and reflects a growing need to collaborate in targeted areas of basic precompetitive R&D, explained Mike Polcari, SEMATECH president/CEO, in a statement. “The new program-based membership model represents a natural evolution of these trends, and responds to industry demands for another option in SEMATECH’s long history of offering flexible participation in our family of companies,” he said.

SEMATECH launched its 3D program in early 2005 and has already generated a comprehensive cost-model and a draft of a 3D roadmap for the International Technology Roadmap for Semiconductors (ITRS), and begun tool and process benchmarking. Future work will focus on development of 3D infrastructure, materials, unit processes, integration, and reliability.

“3D is a critical program for the semiconductor industry, and we’re building the critical mass to help drive it,” said Sitaram Arkalgud, director of SEMATECH’s interconnect division, in a statement. “Realizing its full potential requires the participation of several areas of the industry including design, test, materials, frontend wafer processing, and backend assembly,” he said. “As a result, we are taking an inter-disciplinary approach, and looking for inputs from as many participants as possible.”


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