(March 12, 2007) SHANGHAI, China — SEMICON China 2007, March 2123 in Shanghai, will include CEO forums on wafer processing and test-and-assembly, a discussion of MEMS opportunities, various talks on the logistics of operating in China and in cooperation with China RoHS, and an IC-design suppliers pavilion, in conjunction with the FSA, SEMI, and SICA. Various exhibitors will also highlight cleanroom technologies, advanced automation, and multi-metal compatibilities.