(March 1, 2007) ENDICOTT, NY — Endicott Interconnect Technologies (EI) entered into a manufacturing services agreement with a intravascular ultrasound (IVUS) catheter manufacturer, due to a process development and manufacturing partnership with Unovis-Solutions. In the $3.9 million contract, EI will develop and manufacture a certain quantity of flexible substrates, and assemble flip chips to the substrates, over 2 years.