MCP Built with 20 Stacked Die

The stack was achieved with grinding, handling, and placement technology for 30-&#181m-thick die, attached with 40-&#181m low-loop wire bonds and overhang wire-bond technologies using gold wire. Elpida optimized back-grind conditions and improved the thin-wafer handling process to enable the 20-die stack. The company also set die-bonding condition with minimum stress on the silicon. A process for injecting resin into a narrow gap is part of the assembly procedure.

(April 24, 2007) MUNICH, Germany and WESTFORD, MA &#151 Zuken is supporting free footprint data for Texas Instruments’ digital signal processor (DSP) products to CR-5000 users. The engineering consulting firm’s Japanese, European, and American operations joined the TI DSP Third Party Network, increasing customer access to DSP designs.


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