Nan Ya PCB Boosts Flip Chip Substrate Line

The company is reportedly diversifying product lines in PCBs and substrates and is seeking additional orders for IC substrates in the second half of 2007. CENS suggests that Nan Ya will invest $33 million to expand its Kunshan plant in Jiangsu Province, China, for high-density interconnect (HDI) substrates and thin PCBs.


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