Nan Ya PCB boosts flip chip substrate line

April 23, 2007) – Nan Ya PCB Corp. has added an additional line to its flip chip substrate production capacity, increasing output to 30 million units monthly. The line will produce seven million units, reports the Taiwan Economic News.

The company is trying to diversify its product lines in PCBs and substrates, and is seeking additional orders for IC substrates in 2H07, the paper noted, adding that Nan Ya will invest $33 million to expand its Kunshan plant in China’s Jiangsu Province, for high-density interconnect (HDI) substrates and thin PCBs.

(Courtesy of SST sister publication Advanced Packaging )


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