New SUSS placement/bonding tool targets R&D

The KADETT is suited for advanced packaging, micro-optics, and MEMS assembly. (Photo: SUSS MicroTec)

Apr. 24, 2007 — SUSS MicroTec has unveiled the KADETT, its new placement and bonding system designed for R&D laboratories, universities, and pre-production environments. Originally developed by the Paul Scherrer Institute in Switzerland, the KADETT, has been used for bonding ionizing radiation detectors and it is also well suited for advanced packaging, micro-optics, and MEMS assembly.

SUSS says the KADETT semi-automatic device bonder is a flexible and open platform for accurate assembly and bonding on a variety of substrates. The machine promises accurate pick and place functions; a range of bonding processes including in-situ reflow, thermo-compression, thermo-sonic and adhesive bonding are available for forces up to 75N.

A vision systems uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage to achieve accurate alignment. SUSS says the KADETT’s flexible architecture enables the integration of many processing modules such as a UV glue curing system and ultrasonic bonding head.


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