ProMOS investing in 300mm fab efficiency

April 5, 2007 – As part of efforts to maximize efficiency at its chipmaking operations, ProMOS Technologies Inc. is spending about $30 million to install computer-integration management systems at its 300mm wafer fabs, working with a host of partners including Applied Materials, Oracle, and Hewlett-Packard, according to the Taiwan Economic News. Installations are expected to be completed within six months.

The paper noted that H-P also works with domestic semiconductor industry firms including Winbond and ASE, as well as display firm Innolux. It also cited ProMOS chairman L.M. Chen claiming the systems will turn the company’s 300mm fabs the world’s most efficient chipmaking facilities.


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