SanDisk, Qimonda forge MCP JV

April 26, 2007 – Qimonda AG and SanDisk Corp. have agreed to jointly develop and manufacture multichip packages (MCP) targeting mobile handsets, combining SanDisk’s NAND flash and controllers with Qimonda’s low-power mobile DRAM.

The JV will operate out of Portugal, where Qimonda already has a backend manufacturing site, with MCPs sold to customers through both companies’ existing sales channels. Engineering samples are expected to be available in 2H07, with mass production by year’s end.

“Offering MCPs with advanced mobile DRAM and high capacity NAND Flash will allow Qimonda to optimize the architecture of memory subsystems used in mobile phones to address the growing need of major handset vendors for flexible bandwidth and memory utilization at competitive levels,” said Qimonda president/CEO Kin Wah Loh, in a statement.

“Through this partnership, each of our companies is leveraging the technical skills, IP and capacity investments of its partner to offer an integrated, competitive solution for our respective customers,” added Eli Harari, chairman/CEO of SanDisk.


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