Mirror plans to produce, sell, and license its wire-bonding technology by agreement with Liberty University (Lynchburg, VA), and will locate a facility in Irvine, CA. The proprietary Mirrored Pinout concept is based on clockwise wire bonding, opposite traditional wire-bonding designs. Performance benefits are suggested, as a mirrored-pinout package, mounted to a PCB with a standard package, creates shorter circuit routing, reportedly by up to 80%. Additional benefits include a smaller PCB or other substrate material.
(April 26, 2007) LIVERMORE, CA — FormFactor, Inc., shipped a 26,000 pin-count wafer probe card, based on its PH150XP platform, to packaging and wafer-test house Tera Probe, Inc., for testing advanced DRAM wafers.