Thermal-focused Packages Debut

The manufacturing process is similar to the construction process of many existing StratEdge families, said Tim Going, president. The materials, BeO and copper, reportedly enhance thermal management properties for silicon, silicon carbide, gallium nitride, and other power IC chips. The industry-standard form factors are available in hermetic &#151 sealed with metal or ceramic lids with gold/tin solder preforms &#151 or non-hermetic &#151 sealed with cup-shaped ceramic or liquid-crystal polymer lids with B-stage epoxy preforms.

EPM-2480, 2481, and 2482 dielectric gels are designed to encapsulate packages when outgassing-related contamination poses a problem within a device. The products cure to a soft and compliant silicone, and reportedly reduce stress on assemblies during temperature cycling.


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