The contract manufacturer added competencies for MEMS design, electronic interfacing of MEMS components, and technology for 150-mm wafers. This is the second upgrade at the Crolles facility, which hosts product development, including modeling, simulation, and characterization; interface development; custom assembly, packaging, and test operations; and manufacturing and delivery of qualified MEMS components. Added capacity will help shorten time-to-market and strengthen MEMS production in the industry, said Peter Pfluger, Ph.D., CEO at the company.
(April 18, 2007) BERLIN — The IEEE components, packaging, and manufacturing technology (CPMT) society — an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development — named professor Herbert Reichl, director of Fraunhofer IZM, recipient of its electronics manufacturing technology award.