Tronics Expands MEMS Capabilities

The contract manufacturer added competencies for MEMS design, electronic interfacing of MEMS components, and technology for 150-mm wafers. This is the second upgrade at the Crolles facility, which hosts product development, including modeling, simulation, and characterization; interface development; custom assembly, packaging, and test operations; and manufacturing and delivery of qualified MEMS components. Added capacity will help shorten time-to-market and strengthen MEMS production in the industry, said Peter Pfluger, Ph.D., CEO at the company.

(April 18, 2007) BERLIN &#151 The IEEE components, packaging, and manufacturing technology (CPMT) society &#151 an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development &#151 named professor Herbert Reichl, director of Fraunhofer IZM, recipient of its electronics manufacturing technology award.


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