Wafer Bump Providers Partner

(April 2, 2007) COLORADO SPRINGS, CO and JANGYIN, China &#151 Wafer-bumping service provider IC Interconnect (ICI) and Jiangyin Changdian Advanced Packaging (JCAP), which produces solder, gold, and pillar bumps, formed an international alliance to transfer ICI technologies to Asia and JCAP bumping services to North America.


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