2D, 3D and Beyond: Inspecting Stacked Die in MCPs

The value of fast, accurate inspection capability, which can detect existing defects and preempt further process investment, is multiplied in multichip packaging (MCP) applications by the large investment already made in multiple, fully processed die and the unrecoverable nature of the packaging process. One serious defect can kill its own die and take the rest of the stack down as well.

(May 11, 2007) MILPITAS, CA &#151 SIX SIGMA, a division of Winslow Automation, Inc., integrated its SolderQuik reinforced column grid array technology onto six FPGAs on the Los Alamos National Laboratory Cibola Flight Experiment Satellite (CFEsat). SIX SIGMA reconfigured the FPGAs for Los Alamos to allow these components to withstand extreme thermal cycling while the satellite monitors weather patterns.


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