AMD Orders Flip Chip Equipment

(May 15, 2007) RADFELD, Austria &#151 AMD Penang ordered its first Datacon 8800 FC Quantum flip chip bonder, and is expected to add more in the coming months, to began producing single- and multi-flip chip assemblies for high-end processors. This marks Datacon’s first order for flip chip equipment from an integrated device manufacturer (IDM).


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.