Amkor, UTAC to Cross-license Packaging

(May 15, 2007) CHANDLER, AZ and SINGAPORE &#151 Amkor Technology, Inc. (Chandler), and United Test and Assembly Center Ltd. (UTAC &#151 Singapore) entered a multi-year cross-licensing agreement wherein UTAC will adopt Amkor’s MLF technology and Amkor will use UTAC’s QFN patents. The deal covers intellectual property rights (IPR) and transfer of associated packaging technologies.


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