Amkor, UTAC trade IC package licenses

May 15, 2007 – Amkor Technology Inc. and Singapore’s United Test and Assembly Center Ltd. (UTAC) have formed a multiyear cross-licensing agreement, involving Amkor’s MicroLeadFrame patents and UTAC’s QFN patents, as well as associated packaging technologies.

Amkor’s “MicroLeadFrame” is a proprietary version of “QFN” IC packaging (quad, flat-pack, no lead). The leadframe-based, nearly chip-scale package has an exposed die paddle and leads on the bottom of the package.

“Our MicroLeadFrame package has been widely adopted by IC suppliers as a cost-effective alternative for conventional low lead-count packages,” noted Oleg Khaykin, Amkor’s EVP and COO, in a statement. “We are pleased that UTAC has sought to adopt our technology.”

Lee Joon Chung, UTAC’s group president and CEO, added that the QFN products “are a key part of our assembly strategy, and we are pleased to have entered into a cross licensing arrangement on the MLF/QFN products with Amkor.”


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