Die Sorter Platform

A high-speed system for tape-reel processing, the CS1250 sorter packages wafer-level chip-scale packages, flip chips, and other devices from wafer to tape reel. Four inspection points &#151 pre-pick, post-flip, in-pocket, and post-seal &#151 examine bump size, shape, and array; edge chip; laser mark; position and flatness in pocket; and other parameters.


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