May 21, 2007 – ASSP chipmaker Diodes Inc. says it will consolidate its analog wafer probe and final test operations from Hsinchu, Taiwan, to facilities in Shanghai, China, by the end of July. The move, which will initially result in a $1.3-$1.7 million charge, will save $1.0 million/year, according to the company.

The decision to move manufacturing across the strait to the mainland aims to leverage operational efficiencies, and the company’s existing high-volume manufacturing site already established in Shanghai, noted Keh-Shew Lu, Diodes’ president/CEO. Product design, R&D, sales, marketing, administration, and support will continue to operate out of the Hsinchu Science Park, though about 40 employees will be affected by the transfer.

Diodes acquired Taiwan fabless analog IC company Anachip Corp., a power management IC designer, in January 2006, with main operations in the Hsinchu park.