ECTC Paper Presentation Preview

(May 23, 2007) RENO, NV &#151 The 57th annual Electronic Components and Technology Conference (ECTC), May 29 to June 1 in Reno, NV, will feature developments in packaging, components, and microelectronic systems technology. Paper presentations include four technical pieces from Endicott Interconnect (EI &#151 Endicott, NY) and five by Freescale Semiconductor (Austin, TX).


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