EI Enters Long-term DoD Contract

(May 30, 2007) ENDICOTT, NY &#151 Endicott Interconnect Technologies, Inc. (EI), received a $49 million follow-on production contract from the U.S. Department of Defense (DoD) for a new generation of packaging, PCB, and substrate technologies. The R&D will focus on high-productivity computing, and is part of a five-year agreement.


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