High-accuracy Bonder

KADETT tasks include pick-and-place functions; bonding processes including in-situ reflow, thermocompression bonding, thermosonic, and adhesive attachment; and other advanced packaging, optics, and MEMS interconnection processes. The flexible, open platform accepts processing modules for specific tasks, such as a UV glue-curing system, ultrasonic bonding head, and other additions. The vision system comprises two independent, high-resolution video microscopes, focused on the chip and substrate, with a 0.1-&#181m X/Y alignment stage. SUSS MicroTec Device Bonder Division, Saint Jeroire, France, www.suss.com.


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