1. It was 90° and sunny at the Amkor campus in Chandler, AZ. We took advantage of it for the group picture. (L-R) Barry Miles, senior VP, CSP, BGA and module products; Tim Olson, senior VP, leadframe; Oleg Khaykin, executive VP, COO; Jeff Luth, VP, corporate communications; Gail Flowe, editor-in-chief; Chris Platt, group publisher; Françoise von Trapp, managing editor. Click here to enlarge image
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2. Kent Carrie displays a cantilever probe card from MicroProbe for wafer-testing RF applications. Click here to enlarge image
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3. Flower; von Trapp; and Diane Donnelly, national sales manager, Advanced Packaging, look on as Carrie explains Credence’s 8-inch prober. Needles make electrical contact with pads on the silicon. The test head flips the wafer over to meet with the pogo pins on the tester. The machine can accommodate both cantilever and vertical probe cards. Click here to enlarge image
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4. This Seiko Epson handler picks up the part to be tested from the input tray and sockets it into the test contactor. Once socketed, the tester takes control and electrically tests the device for functionality. The tester then gives a bin signal to the handler, where it automatically sorts the tested units into good and bad trays. Click here to enlarge image
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5. Scott Krupa, senior mixed-signal test engineer, is seen here working on the Verigy 93k tester. Click here to enlarge image
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6. Krupa and Nick Ellis senior RF test engineer, collaborate on the challenges associated with quad-site RF testing.Click here to enlarge image
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1. Flower; Charlotte Frederick, HyperFlo president; and Jack Mulligan, CFO, pose with the base unit of a Hyperflo ENV 1500 featuring a Class 100 clean-room-rated process module with cylindrical vacuum chamber. Click here to enlarge image
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2. Frederick and Mulligan showed us the inner workings of Hyperflo’s closed-loop technology. This part of the system can be kept outside the clean room, allowing the chamber to occupy a smaller footprint inside the clean room. Click here to enlarge image
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3. Mulligan poses with a HyperFlo ENV 3000 batch cleaning system designed to run aqueous and semi-aqueous chemistries. Click here to enlarge image
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4. Figure 4 features a cylindrical chamber with optional viewport lid.Click here to enlarge image
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5. while Figure 5 shows an example of a rectangular chamber. Tanks can be made in different shapes and sizes because, under vacuum, all surfaces see equal pressure no matter what the size of the chamber. Click here to enlarge image
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6. In Frederick’s R&D corner of the clean room, von Trapp; Steven Krsna, staff engineer; Frederick; and Flower shield top-secret research.Click here to enlarge image
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1. We had our largest Roadshow roundup yet. Many of these Antares employees came to town for the BiTS workshop and Antares annual sales meetings. Click here to enlarge image
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2. Oded Lendner, COO and president for the package test business unit, joined in the discussions, noting that the socket market is so fragmented that providing customers with turnkey solutions allows them to integrate the technology and test components in-house. Click here to enlarge image
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3. 4. Samples of Quatrix, a photo-lithography system for testing ICs that replaces pogo pins with plate- and etch-formed contact interface points. Click here to enlarge image
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5. Al Santos, manufacturing engineering technician, demonstrates how this retrofitted wire-bonding equipment creates Quatrix test socket interface points that replace traditional pogo-pin technology. Click here to enlarge image
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6. IIa Pal, product development engineer; and Mark Murdza, director of marketing, display a DUT board device simulator for testing the lifeline of sockets and components. Click here to enlarge image
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7. Antares manufactures its own prototype test sockets on CNC machines like the one shown here. Click here to enlarge image
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8. It takes 3.5 hours to get a piece of Victrex PEEK, a ceramic and polymer insulating compound, machined from a solid block (left) to the 5-mm-pitch, 1300-holed test socket (right).Click here to enlarge image
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