May 22, 2007 – Intel Corp. says that its future processors, starting with its 45nm line utilizing high-k dielectrics and metal gates (HK+MG), will incorporate 100% lead-free packaging designs, including pin grid array, ball grid array and land grid array. Next year the company plans to transition its 65nm chipsets also to 100% lead-free technology.

The chipmaker says it will use a tin/silver/copper alloy to get the last 5% of lead out of its solder joints, which connect the silicon die to the packaging substrate, using what it refers to as a “secret sauce” implementation method.

“Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling,” said Nasser Grayeli, VP and director of assembly test technology development, Intel’s technology and manufacturing group, in a statement.