May 4, 2007 – Fujikura says it’s incorporating a pair of new techniques to make image sensors for digital cameras that can be made half as thin and with two-thirds the surface area of existing sensors, notes the Nikkei Business Daily.
The first tweak involves making through-hole interconnects in the image sensor chip, so that electrodes can be placed on the underside and the chip mounted directly above them on the board. The company is also utilizing wafer-level packaging, by sealing the chips in resin and slicing them thinner.
Image sensors vary in size depending on pixel resolution, but in general the new process enables production of devices with 150-200-micron thicknesses, the paper notes. Fujikura expects the new process combination to lead to new business from camera module makers by as soon as the next fiscal year.