SUSS launches next-gen wafer bonding with ELAN CB8 tool


The ELAN CB8 is based on a new design platform. (Photo: BusinessWire)

May 9, 2007 — SUSS MicroTec, supplier of precision manufacturing and test equipment for the semiconductor and related markets, has launched what it calls “next generation, groundbreaking wafer-bonding technology” in the form of ELAN CB8. The new tool is based on an entirely new design platform and promises to enable best-in-class production across a wide range of performance parameters.

ELAN CB8 offers force and temperature uniformity (±5% and ±1% respectively) as well as a super clean, high-vacuum environment to improve yield. The tool also boasts rapid heat up and cool down times.

The ELAN CB8 integrates a number of technologies, some patented. Its pressure column design enables pressure uniformity, which is confirmed via load cell verification. SUSS says it is the only company to offer wedge error compensation (WEC), which ensures planarity before every single bond. Vacuum isolated heaters allow heat to be directed where it is needed — at the wafer — while the silicon nitride heater material provides strength and conduction over time and under elevated temperatures. Finally, a rigid 3-post load-bearing, superstructure frame evenly and predictably supports the extremely high forces required for many bonding processes.

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