SUSS targets MEMS production with double-sided alignment tool

May 2, 2007 — SUSS MicroTec has introduced the DSM200, an automated metrology system for double-sided (front-to-back) alignment and exposure applications.

The cassette-cassette system enables verification of alignment accuracy on wafers from 2 inches to 200mm. Incorporating new pattern-recognition technology, it promises measurement accuracy of 0.2 microns at 3 sigma with minimial operator intervention.

Based on SUSS’s MA200Compact Mask Aligner, the DSM200 targets the manufacture of MEMS devices, power semiconductors, and optoelectronics.

SUSS’s DSM200 double-sided metrology system. (Photo: Business Wire)

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