Alcatel, Tronics join for MEMS DRIE

June 7, 2007 – Tronics Microsystems SA and Alcatel Micro Machining Systems (AMMS) say they will jointly develop deep reactive ion etch (DRIE) systems for “extreme-performance” MEMS.

The work will utilize Tronics’ test protocols to evaluate and qualify new advanced DRIE manufacturing processes from Alcatel, which the company will use to further enhance its technology for advanced high-aspect-ratio, high-yield and manufacturing-proven processes. In return, Tronics will gain “priority access” to Alcatel’s latest process modules and services.

“It is a great opportunity for us to benefit from Tronics’ unique manufacturing experience in high- performance SOI-based inertial transducers and 3D packaging to qualify our future DRIE process modules with them,” said Jean-Marc Gruffat, director of products at AMMS, in a statement. “Our goal is to push the limits of high-aspect-ratio DRIE processes with high- accuracy controlled profile, excellent uniformity and reproducibility in order to provide our customers best-in-class, manufacturing-proven and high-yield DRIE production tools for next-generation MEMS and 3D semiconductors.”

“This partnership marks a major milestone in strengthening our technological and market leadership in manufacturing custom products for demanding applications,” including MEMS geophones, miniature SMD accelerometers, and MEMS gyros transducers, noted St


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