AMIS, MagnaChip expand foundry pact

June 14, 2007 – AMI Semiconductor and Korea’s MagnaChip Semiconductor have extended an existing partnership, under which AMIS will transfer its 0.35-micron SmartPower mixed-signal technology to MagnaChip for manufacturing, plus continue existing joint development of ultralow-power technology. The two already were collaborating on 0.18-micron development and foundry work since Nov. 2005.

The two firms’ 0.18-micron ULP process combines 0.1pA/sq. micron for the core logic transistor with an optimized design environment, including low-power standard cells and SRAM compilers from Virage Logic. The technology incorporates embedded EEPROM, all standard mixed-signal modules and ultra-high reliability.

The ULP process targets battery powered and other low-power consumer and medical devices, while the SmartPower process is for high-voltage telecom products, such as highly integrated power-sourcing equipment.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.